【中文】本發明為一種半導體封裝模組的切割方法及其半導體封裝單元。半導體封裝模組的切割方法包括以下步驟。於基板上設置複數個半導體晶片，並以封裝層包覆半導體晶片及基板的表面。在基板的表面定義複數個切割線，並以雷射在切割線上的基板或封裝層上形成複數個點狀凹陷部，而後對基板施力，使得基板沿著切割線裂開，並形成複數個半導體封裝單元。
【英文】A cutting method of a semiconductor package module and a semiconductor package unit are provided. The cutting method of the semiconductor package module includes steps as follow. A plurality of semiconductor chips are disposed on a substrate, and the semiconductor chips and a surface of the substrate are covered with a packaging layer. A plurality of cutting lines are defined on the surface of the substrate. A plurality of dot-like depressions are formed on the substrate or the packaging layer along the cutting lines by laser. A force is applied to the substrate such that the substrate is broken along the cutting lines and a plurality of semiconductor package units are formed.
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